Through-Hole Via On Saw Streets

ABSTRACT

A semiconductor device is manufactured by, first, providing a wafer designated with a saw street guide. The wafer is taped with a dicing tape. The wafer is singulated along the saw street guide into a plurality of dies having a plurality of gaps between each of the plurality of dies. The dicing tape is stretched to expand the plurality of gaps to a predetermined distance. An organic material is deposited into each of the plurality of gaps. A top surface of the organic material is substantially coplanar with a top surface of a first die of the plurality of dies. A plurality of via holes is formed in the organic material. Each of the plurality of via holes is patterned to each of a plurality of bond pad locations on the plurality of dies. A conductive material is deposited in each of the plurality of via holes.

FIELD OF THE INVENTION

The present invention relates in general to semiconductor devices and,more particularly, to a through-hole via stackable semiconductor device.

BACKGROUND OF THE INVENTION

In a growing trend, semiconductor manufacturers have increasinglyadopted three-dimensional (3D) interconnects and packaging forsemiconductor devices. Three-dimensional interconnects give advantagessuch as size reduction, reduced interconnect length and integration ofdevices with different functionality within a respective package.

One of the various ways of implementing 3D interconnects involves usingso-called “through-hole via” technology. The location of a through-holevia can be located either within a semiconductor chip, or “die,” oroutside the die (i.e., along a so-called “saw street” guide).

However, current through-hole via technology poses several limitations.A via located within a semiconductor chip restricts the freedom ofhaving additional circuitry within the chip. As can be appreciated, arespective location of a through-hole via forecloses the placement ofcircuitry at that location, As a result, the functionality of the chip,and therefore, a device making use of the chip, is limited.

A via located outside the semiconductor chip (i.e., along the saw streetguide) necessitates a wider saw street to accommodate the creation of athrough-hole. As a result, yields (i.e., chips per wafer) are reduced.

SUMMARY OF THE INVENTION

In light of the foregoing, the aim of the present invention is toprovide a through-hole via stackable semiconductor device without havingany of the accompanying limitations previously described.

Accordingly, in one embodiment, the present invention is a semiconductordevice, comprising a first die having top, bottom, and peripheralsurfaces, a bond pad formed over the top surface, an organic materialconnected to the first die and disposed around the peripheral surface, avia hole formed in the organic material, a metal trace connecting thevia hole to the bond pad, and a conductive material deposited in the viahole.

In another embodiment, the present invention is a method ofmanufacturing a semiconductor device, comprising providing a waferdesignated with a saw street guide, taping the wafer with a dicing tape,singulating the wafer along the saw street guide into a plurality ofdies having a plurality of gaps between each of the plurality of dies,stretching the dicing tape to expand the plurality of gaps to apredetermined distance, depositing an organic material into each of theplurality of gaps, wherein a top surface of the organic material issubstantially coplanar with a top surface of a first die of theplurality of dies, forming a plurality of via holes in the organicmaterial, patterning each of the plurality of via holes to each of aplurality of bond pad locations on the plurality of dies, depositing aconductive material in each of the plurality of via holes, andsingulating each of the plurality of dies from the dicing tape.

In still another embodiment, the present invention is a method ofmanufacturing a semiconductor device, comprising providing a waferdesignated with a saw street guide, taping the wafer with a first dicingtape, singulating the wafer along the saw street guide into a pluralityof dies having a plurality of first gaps between each of the pluralityof dies, picking the plurality of dies from the dicing tape, placing theplurality of dies onto a first wafer support system to obtain aplurality of second gaps of a predetermined width between each of theplurality of dies, depositing an organic material into each of theplurality of gaps to render a recoated wafer, wherein a top surface ofthe organic material is substantially coplanar with a top surface of afirst die of the plurality of dies, transferring the recoated wafer ontoa second wafer support system, forming a plurality of via holes in theorganic material, patterning each of the plurality of via holes to eachof a plurality of bond pad locations on the plurality of dies,depositing a conductive material in each of the plurality of via holes,transferring the recoated wafer onto a second dicing tape, andsingulating each of the plurality of dies from the second dicing tape.

In still another embodiment, the present invention is a method ofmanufacturing a semiconductor device, comprising providing a first diehaving top, bottom, and peripheral surfaces, providing a bond pad formedover the top surface, providing an organic material connected to thefirst die and disposed around the peripheral surface, providing a viahole formed in the organic material, providing a metal trace connectingthe via hole to the bond pad, and depositing a conductive material inthe via hole.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary prior art method of making a wafer levelchip scale package;

FIGS. 2A and 2B illustrate a first embodiment of a through-hole viastackable semiconductor device in a top and side view, respectively;

FIGS. 3A and 3B illustrate a first step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 4A and 4B illustrate a second step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 5A and 5B illustrate a third step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 6A and 6B illustrate a fourth step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 7A and 7B illustrate a fifth step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 8A and 8B illustrate a sixth step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 9A and 9B illustrate a seventh step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 10A and 10B illustrate an eighth step in a first exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 11A and 11B illustrate a second embodiment of a through-hole viastackable semiconductor device incorporating a plurality of completethrough-hole vias, as seen in a top and side view, respectively;

FIGS. 12A and 12B illustrate a third step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 13A and 13B illustrate a fourth step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 14A and 14B illustrate a fifth step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 15A and 15B illustrate a sixth step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 16A and 16B illustrate a seventh step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 17A and 17B illustrate an eighth step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 18A and 18B illustrate a ninth step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIGS. 19A and 19B illustrate a tenth step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively;

FIG. 20 illustrates a third exemplary embodiment of a through-hole viastackable semiconductor device, shown utilizing a die-to-die stackingconfiguration in a side view;

FIG. 21 illustrates a fourth exemplary embodiment of a through-hole viastackable semiconductor device, shown utilizing a die-to-die stackingconfiguration which incorporates solder paste, again in a side view;

FIG. 22 illustrates a fifth exemplary embodiment of a through-hole viastackable semiconductor device, having multiple rows of bond pads andmultiple rows of via holes as shown in a top view;

FIG. 23 illustrates a sixth exemplary embodiment of a through-hole viastackable semiconductor device, incorporating a row of half-cut viaholes coupled to a row of bond pads on opposing sides of a die as shownin a top view;

FIG. 24 illustrates a seventh exemplary embodiment of a through-hole viastackable semiconductor device, incorporating dummy via holes onopposing sides as shown in a top view;

FIG. 25 illustrates an eighth exemplary embodiment of a through-hole viastackable semiconductor device, incorporating dummy via holes on asingle side as shown in a top view; and

FIG. 26 illustrates a ninth exemplary embodiment of a through-hole viastackable semiconductor device, depicting two stacked dies utilizing thedummy via holes as seen in FIGS. 24 and 25 to connect a top die with awire-bonding process.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention is described in one or more embodiments in thefollowing description with reference to the Figures, in which likenumerals represent the same or similar elements. While the invention isdescribed in terms of the best mode for achieving the invention'sobjectives, it will be appreciated by those skilled in the art that itis intended to cover alternatives, modifications, and equivalents as maybe included within the spirit and scope of the invention as defined bythe appended claims and their equivalents as supported by the followingdisclosure and drawings.

FIG. 1 illustrates an exemplary prior art method 100 of making a waferlevel chip scale package. A plurality of chips 102 are cut from a wafer.Each chip 102 has a plurality of protruding bonding pads 104 located onthe active surface of the chip 102.

The plurality of chips 102 are disposed on the top surface of aretractable film 106. The retractable film 106 is secured by a frame108. The frame 108 is fixed by a fixture 110 and the retractable film106 is displaced on a work platform 112 and stretched to a certaindistance.

The platform 112 can move up relative to the fixture 110. The wafer iscut by a cutter into the plurality of chips 102 as shown which have beenencapsulated into semiconductor packages and then sawn by a cutter 118.A shaft 114 moves upward to lift the platform 112 relative to thefixture 110.

The present invention improves upon the exemplary prior art method 100of manufacture to render a through-hole via semiconductor device whichis, in some embodiments, stacked together for specific applications andimplementations.

FIGS. 2A and 2B illustrate a first embodiment of a through-hole viastackable semiconductor device 200, in a top and side view,respectively. Device 200 has an incorporated die 202. The device 200includes a plurality of bond pads 204 which are deposited on an activeside of the semiconductor die 202. The bonding pads 204 can be depositedon the electrode terminals of the die 202 by a plating process, orotherwise. The materials of the bonding pads 204 can be made fromconductive metal, such aluminum (Al). The bonding pads 204 can be joinedto a substrate by a soldering process.

A series of metal traces 206 electrically couple the bond pads 204 tothe via 208. As seen in FIG. 2B, the via 208 extends vertically from theactive, top surface 212 of the die 202 and surrounding material 210 to abottom surface of the die and surrounding material 210, which isconsistent with a through-hole via design.

The surrounding material 210, which is, for purposes of the presentinvention, referred to as an “organic material” is deposited around aperipheral surface 214 of the die 202 as shown. The organic material 210is an improvement and a departure from that of the prior art, as will befurther described. The organic material can include such materials asbenzocyclobutene (BCB), a polyimide (PI) material, or similar. As shown,the vias 208 are formed in the organic material 210 and organizedaccording to rows. In the present embodiment 200, the vias 208 areformed in each side of the organic material 210 (e.g., sides 216, and218) so as to completely surround the periphery of die 202. Each of theplurality of bond pads 204 is electrically coupled to each of theplurality of vias 208.

As will be seen, through-hole vias 208 can be formed in variousconfigurations, for example, along multiple rows. Further, half-cut vias(as shown in the instant figure) or complete, uncut vias 208 can beformed in various embodiments to suit particular implementations. Thesemiconductor device 200 can be stacked or coupled with additional dies202 in a variety of configurations.

FIGS. 3A and 3B illustrate a first step in a first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively. A wafer300 is provided. A series of bond pads 204 are formed on an activesurface of the wafer as shown. The wafer is designated with a saw streetguide 302.

FIGS. 4A and 4B illustrate a second step in the first exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively.The wafer 300 is singulated into the depicted pieces 400 for a firsttime by a cutting source 402. The cutting source 402 can include a sawor a laser cutting tool.

Prior to singulation, the wafer 300 is placed on a dicing tape 404,which keeps the various segments 400 in place during the singulationprocess. Subsequent to the singulation process, a series of gaps 406 isformed between respective segments 400 as shown.

FIGS. 5A and 5B illustrate a third step in the first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively. Wafer300, in the depicted respective segments, undergoes an expansionprocess. The dicing tape 404 can be stretched by various techniques(i.e., by using an expansion table), to render a series of gaps 502having predetermined distances 504. The depicted arrows 506 indicate thevarious expansion directions undergone by the wafer expansion process.

As a next step, FIGS. 6A and 6B illustrate a fourth step in the firstexemplary method of manufacturing the through-hole via stackablesemiconductor device shown in FIGS. 2A and 2B as seen in a side and topview, respectively. The various gaps 502 seen in FIGS. 5A and 5B arefilled with the previously described organic material 602. A plane 604corresponding to a top surface of the filled segments 600 issubstantially coplanar with a plane 606 corresponding to a top surfaceof the organic material 602.

The organic material 602 application can be performed by such methods asspin-coating, needle dispensing, or a similar application.

FIGS. 7A and 7B illustrate a fifth step in the first exemplary method ofmanufacturing the through-hole via stackable semiconductor device shownin FIGS. 2A and 2B as seen in a side and top view, respectively.Segments 700 undergo a process to form a plurality of via holes 702 inthe organic material 602 as shown. The via holes can be formed invarious processes, including a laser via drilling process or an etchingprocess. As is seen, each of the via holes is configured in the organicmaterial 602 to correspond to a respective bump pad 204 to which the viahole will be associated.

Turning to FIGS. 8A and 8B, a sixth step in the first exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively,is shown. FIGS. 8A and 8B illustrate a metal patterning process whichconnects a series of metal traces 206 from the bond pads 204 to the viaholes 702. Here again, the metal traces 206 electrically connect thebond pads to each of the via holes 702 locations as shown.

FIGS. 9A and 9B illustrate a seventh step in the first exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B. A via hole metal deposition process isperformed to the assembly 900 to deposit conductive material into eachof the via holes 702, forming a series of metal vias 902. The conductivematerial can materials such as aluminum (Al), copper (Cu), tungsten (W),or any other conductive metal, or any combination of metal alloy. Again,the metal vias 902 are formed in the organic material 602. A variety ofmethods and techniques can be used to form the metal vias, such as aplating or plugging process.

FIGS. 10A and 10B illustrate an eighth step in the first exemplarymethod of manufacturing the through-hole via stackable semiconductordevice shown in FIGS. 2A and 2B. The wafer assembly 300, and 900 issingulated for a second time by a cutting source 402 to form gaps 904.As would be understood by one skilled in the art, the various dies 202shown in FIGS. 10A, 10B, and the preceding exemplary figures represent asmaller portion of a totality of chips which are yielded from aparticular wafer 300. As such, following the conclusion of the secondsingulation step, a majority of dies 202 are rendered to be like theembodiment shown in FIGS. 2A and 2B, where the organic material 210completely surrounds the peripheral surface of the die 202, and thethrough-hole vias 902 are configured in rows along each side surface ofthe die as previously represented.

In one embodiment, following the singulation step depicted in FIGs. 10Aand 10B, individual dies 202 are removed by a die pick and place processto remove each die 202 from the dicing tape 404.

FIGS. 11A and 11B illustrate a second embodiment of a through-hole viastackable semiconductor device 906 incorporating a plurality of completethrough-hole vias, as seen in a top and side view, respectively. Hereagain, the various features seen in the previous figures are shown,including a die 202, bond pads 204, and metal tracings which are formedon the active surface 212 of the die 202. In the instant embodiment 906,the respective through-hole vias 908 are “complete,” in lieu of beinghalf-cut as seen in the previous embodiment. The depicted completethrough-hole vias 908 can be formed by a particular configuration of thesaw street guide 302 as seen in FIGS. 3A and 3B. A wider saw streetguide 302 allows the organic material 602 to be cut as shown, retaininga complete via hole 908.

FIGS. 12A and 12B illustrate a third step in a second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively.The second method of manufacture as described shares the first two steps(i.e., providing a wafer and singulation into respective segments uponthe dicing tape 404) as the first exemplary method previously described.In addition, various features (i.e., bond pads 204) are again seen.

As a next step, wafer 300 segments 550 are picked from the first dicingtape 404 and placed onto a so-called “wafer support system” 405 as seen.The wafer support system can logically include a second dicing tape 405.However, the wafer support system can also be a temporary wafer supportsystem, such as glass, ceramic, laminate, or silicon (Si) substrate. Inone embodiment, the sawn dies 202 are picked from the dicing tape 404and placed onto the wafer support system 405 using pick and placemachines. The pick and place process renders a gap 406 having apredetermined width or distance 412 between respective segments 550.

FIGS. 13A and 13B illustrate a fourth step in the second exemplarymethod of manufacturing the through-hole via stackable semiconductordevice shown in FIGS. 2A and 2B. The organic material 602 is againapplied to segments 650 in a similar spin-coating, needle dispensing, orother manner as previously described. Plane 642 of segments 650 issubstantially coplanar with plane 654 of organic material 602.

Turning to FIGS. 14A and 14B, a fifth step in the second exemplarymethod of manufacturing the through-hole via stackable semiconductordevice shown in FIGS. 2A and 2B is shown. The recoated wafer 300 istransferred onto a second wafer support system 408. The second wafersupport system can again include glass, silicon (Si) substratematerials, ceramic, and laminate materials.

FIGS. 15A and 15B illustrate a sixth step in the second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B as seen in a side and top view, respectively.In a step 750 similar to that shown in FIGS. 7A and 7B, a plurality ofvia holes 702, is formed in the organic material 602 to coincide withthe bond pads 204.

FIGS. 16A and 16B illustrate a seventh step 850 in the second exemplarymethod of manufacturing the through-hole via stackable semiconductordevice shown in FIGS. 2A and 2B as seen in a side and top view,respectively. Step 850 is again similar to that shown in FIGS. 8A and 8Bof metal patterning of metal traces 206 to electrically couple the bondpad 204 locations to the via 702 locations.

FIGS. 17A and 17B illustrate an eighth step 950 in the second exemplarymethod of manufacturing the through-hole via stackable semiconductordevice shown in FIGS. 2A and 2B. The vias 702 are plugged, plated orotherwise deposited with a conductive material to fill the via holes 702and render the metal vias 902 as shown.

Following the metal via 902 formation process, the via hole wafer 960 istransferred onto an additional dicing tape 410 as shown in FIGs, 18A and18B, which illustrates the depicted ninth step.

FIGS. 19A and 19B illustrate a tenth step in the second exemplary methodof manufacturing the through-hole via stackable semiconductor deviceshown in FIGS. 2A and 2B. A cutting source 402 is again used tosingulate the via hole wafer 960 into the depicted segments 970,resulting in the gaps 904. As a final step, following the secondsingulation process, a die pick and place machine can be utilized toagain remove each device 200 from the dicing tape 410.

FIG. 20 illustrates a third exemplary embodiment of through-hole viastackable semiconductor devices 910, shown utilizing a die-to-diestacking configuration in a side view. A series of devices 200 can bestacked 910 as shown to suit a particular application. Each of the metalvias 902 can be coupled 912 using a direct via metal bonding process. Asone skilled in the art would anticipate, any number of devices 200 canbe stacked as shown to realize a desired implementation.

FIG. 21 illustrates a fourth exemplary embodiment of through-hole viastackable semiconductor devices, shown utilizing a die-to-die stackingconfiguration which incorporates solder paste 916, again in a side view.The solder paste 916 includes a mix of small solder particles and flux.A variety of solder pastes of various materials can be incorporated. Thesolder paste 916 can be applied using a reflow soldering method tocreate a strong metallurgical bond between each of the stacked devices914.

A fifth exemplary embodiment of a through-hole via stackablesemiconductor device 918 is shown in FIG. 22. The present embodimentincludes multiple rows of bond pads 204 and multiple rows of via holes902 as shown in a top view which are appropriately connected with metaltracings 206. Each of the via holes 902 are disposed in the organicmaterial 602 as shown. Any number of configurations of dies 202 havingmultiple rows of bond pads 204 and multiple rows of via holes 902 can beimplemented. In addition to the present embodiment 918, anotherembodiment can be realized which connects the depicted half-cut outervias 902 to bond pads 204 which are not located on the active surface ofdie 202, but on an additional surface, such as an additional die 202 orelsewhere as a specific implementation requires.

A sixth exemplary embodiment of a through-hole via stackablesemiconductor device 920 is shown in FIG. 23. Device 920 illustrates anadditional configuration of bond pads 204, traces 206, and a series ofhalf-cut vias 902 which are disposed on opposing sides of a die 202.Here again, the dies 902 are formed in the organic material 602 which isdisposed on each peripheral side of die 202 as shown. In a variation ofthe depicted embodiment 920, a configuration can include complete vias902.

A seventh exemplary embodiment of a through-hole via stackablesemiconductor device 922 is depicted in FIG. 24. Device 922 includes aseries of so-called “dummy” via holes 924 which are disposed on opposingsides of the die 202 as shown. Vias 902 are disposed on the left andright hand side as shown. Dummy via holes 924 can provide for electricalconnectivity through the device 922 for specific applications. Dummy viaholes 924 can be used to connect an additional device 922 or packageusing a wire bonding process. In addition, the holes 924 can act as aground or as a conduit for input/output (I/O) signals.

Dummy holes 924 can be configured, as with vias 902, in a variety ofimplementations. For example, multiple rows, or full or half-cut holes924 can be implemented. FIG. 25 illustrates one such embodiment of adevice 926, which includes a row of half-cut dummy vias 924 on the leftside of die 202, and a row of through-hole vias 902, on the right sideof die 202, again disposed in the organic material 602.

FIG. 26 illustrates a ninth exemplary embodiment of a through-hole viastackable semiconductor device 928, depicting two stacked dies 202 and203 utilizing the dummy via holes 902 as seen in FIGS. 24 and 25 toconnect a top die 203 with a wire-bonding process. A series of bond pads205 is disposed on an active surface of the die 203. Wire bonds 207connect the bond pads 204 to the vias 902. A dielectric, insulating orbonding material 209 is disposed between the die 202 and 203 to providestructural support for the device/package 928.

Semiconductor devices, such as device 200 incorporating a series ofthrough-hole vias 208 or 902 can provide a variety of functionality andflexibility in various applications. Use of the organic material 210allows placement of the vias 208 outside the die 202, which allows foradditional circuitry within the die 202 and enhancing the functionalityof the device 200. In addition, by using the organic material 210instead of wafer 300 material, the respective yield per wafer isincreased. The organic material can be configured to be as thick asneeded to accommodate a variety of vias 208 in any number ofapplications.

While one or more embodiments of the present invention have beenillustrated in detail, the skilled artisan will appreciate thatmodifications and adaptations to those embodiments may be made withoutdeparting from the scope of the present invention as set forth in thefollowing claims.

1. A semiconductor device, comprising: a first die having top, bottom,and peripheral surfaces; a bond pad formed over the top surface; anorganic material connected to the first die and disposed around theperipheral surface; a via hole formed in the organic material; a metaltrace connecting the via hole to the bond pad; and a conductive materialdeposited in the via hole.
 2. The semiconductor device of claim 1,wherein the conductive material is deposited using a plating or pluggingprocess.
 3. The semiconductor device of claim 1, wherein the organicmaterial includes a benzocyclobutene (BCB), polyimide (PI), or acrylicresin material.
 4. The semiconductor device of claim 1, wherein thefirst die is singulated from a plurality of dies along a saw streetguide.
 5. The semiconductor device of claim 1, wherein the organicmaterial is applied using a spin coating or needle dispensing process.6. The semiconductor device of claim 1, wherein the via hole is formedin the organic material using a laser via drilling process or an etchingprocess.
 7. The semiconductor device of claim 1, further including asecond die stacked above the first die.
 8. The semiconductor device ofclaim 7, wherein the second die is stacked above the first die using adirect via metal bonding process or a solder paste.
 9. The semiconductordevice of claim 1, further including: a plurality of additional bondpads, formed over the top surface of the first die and oriented along abond pad row, and a plurality of additional via holes, formed in theorganic material and oriented along a via hole row.
 10. Thesemiconductor device of claim 1, further including a dummy via hole toconnect an additional semiconductor device, act as a ground, or transferinput/output (I/O) signals.
 11. The semiconductor device of claim 10,wherein the dummy hole is oriented on a first side of the peripheralsurface, or oriented on a first side and an opposing side of theperipheral surface.
 12. The semiconductor device of claim 4, wherein thevia hole is half-cut or complete, depending on an orientation of the sawstreet guide.
 13. A method of manufacturing a semiconductor device,comprising: providing a wafer designated with a saw street guide; tapingthe wafer with a dicing tape; singulating the wafer along the saw streetguide into a plurality of dies having a plurality of gaps between eachof the plurality of dies; stretching the dicing tape to expand theplurality of gaps to a predetermined distance; depositing an organicmaterial into each of the plurality of gaps, wherein a top surface ofthe organic material is substantially coplanar with a top surface of afirst die of the plurality of dies; forming a plurality of via holes inthe organic material; patterning each of the plurality of via holes toeach of a plurality of bond pad locations on the plurality of dies;depositing a conductive material in each of the plurality of via holes;and singulating each of the plurality of dies from the dicing tape. 14.The method of manufacture of claim 13, wherein the organic materialincludes a benzocyclobutene (BCB), polyimide (PI), or acrylic resinmaterial.
 15. The method of manufacture of claim 13, wherein the organicmaterial is applied using a spin coating or needle dispensing process.16. The method of manufacture of claim 13, wherein the plurality of viaholes is formed in the organic material using a laser via drillingprocess or etching process.
 17. The method of manufacture of claim 13,wherein stretching the dicing tape to expand the plurality of gaps to apredetermined distance is performed using an expansion table.
 18. Themethod of manufacture of claim 13, further including picking each of theplurality of dies from the dicing tape.
 19. A method of manufacturing asemiconductor device, comprising: providing a wafer designated with asaw street guide; taping the wafer with a first dicing tape; singulatingthe wafer along the saw street guide into a plurality of dies having aplurality of first gaps between each of the plurality of dies; pickingthe plurality of dies from the first dicing tape; placing the pluralityof dies onto a first wafer support system to obtain a plurality ofsecond gaps of a predetermined width between each of the plurality ofdies; depositing an organic material into each of the plurality of gapsto render a recoated wafer, wherein a top surface of the organicmaterial is substantially coplanar with a top surface of a first die ofthe plurality of dies; transferring the recoated wafer onto a secondwafer support system; forming a plurality of via holes in the organicmaterial; patterning each of the plurality of via holes to each of aplurality of bond pad locations on the plurality of dies; depositing aconductive material in each of the plurality of via holes; transferringthe recoated wafer onto a second dicing tape; and singulating each ofthe plurality of dies from the second dicing tape.
 20. The method ofmanufacture of claim 19, wherein the first wafer support systemcomprises a third dicing tape.
 21. The method of manufacture of claim19( wherein the first or second wafer support systems include a glass,silicon, or ceramic substrate.
 22. The method of manufacture of claim19, wherein the organic material includes a benzocyclobutene (BCB),polyimide (PI), or acrylic resin material.
 23. The method of manufactureof claim 19, wherein the organic material is applied using a spincoating or needle dispensing process.
 24. The method of manufacture ofclaim 19, wherein the plurality of via holes is formed in the organicmaterial using a laser via drilling process or etching process.
 25. Themethod of manufacture of claim 19, further including picking each of theplurality of dies from the second dicing tape.
 26. A method ofmanufacturing a semiconductor device, comprising: providing a first diehaving top, bottom, and peripheral surfaces; providing a bond pad formedover the top surface; providing an organic material connected to thefirst die and disposed around the peripheral surface; providing a viahole formed in the organic material; providing a metal trace connectingthe via hole to the bond pad; and providing a conductive materialdeposited in the via hole.
 27. The method of manufacture of claim 26,wherein the organic material includes a benzocyclobutene (BCB),polyimide (PI), or acrylic resin material.
 28. The method of manufactureof claim 26, wherein the first die is singulated from a plurality ofdies along a saw street guide.
 29. The method of manufacture of claim26, wherein the organic material is applied using a spin coating orneedle dispensing process.
 30. The method of manufacture of claim 26,wherein the via hole is formed in the organic material using a laser viadrilling process or etching process.
 31. The method of manufacture ofclaim 26, further including providing a second die stacked above thefirst die.
 32. The method of manufacture of claim 31, wherein the seconddie is stacked above the first die using a direct via metal bondingprocess or a solder paste.
 33. The method of manufacture of claim 26,further including: providing a plurality of additional bond pads, formedover the top surface of the first die and oriented along a bond pad row,and providing a plurality of additional via holes, formed in the organicmaterial and oriented along a via hole row.
 34. The method ofmanufacture of claim 26, further including providing a dummy via hole toconnect an additional semiconductor device, act as a ground, or transferinput/output (I/O) signals.
 35. The method of manufacture of claim 34,wherein the dummy hole is oriented on a first side of the peripheralsurface, or oriented on a first side and an opposing side of theperipheral surface.
 36. The method of manufacture of claim 28, whereinthe via hole is half-cut or complete, depending on an orientation of thesaw street guide.